Semiconductor device in which a semiconductor chip mounted...

Details Semiconductor device in which a semiconductor chip mounted... Semiconductor device in which a semiconductor chip mounted...

2005-12-06

2005-12-06

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S774000, C257S773000, C257S784000, C257S786000, C257S698000, C257S691000, C257S667000, C257S787000, C257S788000, C257S795000, C361S774000, C361S761000

Reexamination Certificate

active

06972488

ABSTRACT:
A semiconductor device includes (a) a printed wiring board, (b) a semiconductor chip mounted on the printed wiring board, (c) a molded resin formed on the printed wiring board, covering the semiconductor chip therewith, and (d) at least one metal wiring formed on the printed wiring board and extending externally beyond the molded resin. The metal wiring is plated with a metal having a small adhesion force with the molded resin. An interfacial surface between the metal and the molded resin acts as a path through which moisture contained in the semiconductor device escapes outside when the semiconductor device is heated.

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