Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-09-06
2005-09-06
Wilczewski, Mary (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S778000, C257S780000, C257S783000
Reexamination Certificate
active
06940175
ABSTRACT:
A semiconductor device includes (i) spacers between a first electronic component and a second electronic component facing each other, for keeping a distance between the first and second electronic components constant and (ii) combining parts for combining the first electronic component with the second electronic component. The spacers are made of liquid resin material made of thermosetting resin, and the combining parts are made of liquid conductive combining material including metal and thermosetting resin. A manufacturing method of the semiconductor device includes the steps of: forming the spacers on first electrode pads by hardening the liquid resin material; providing the liquid conductive combining material on either the first electrode pads or second electrode pads; aligning the first electronic component with the second electronic component so that (i) the spacers contact with the second electrode pads and (ii) the liquid conductive combining material contact with either at least a part of one the first electrode pads or at least part of one of the second electrode pads; and combining the first electronic component with the second electronic component by hardening the liquid conductive combining material. The steps above are carried out in this order.
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Ishio Toshiya
Iwazaki Yoshihide
Mori Katsunobu
Nakanishi Hiroyuki
Birch & Stewart Kolasch & Birch, LLP
Lewis Monica
Sharp Kabushiki Kaisha
Wilczewski Mary
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