Semiconductor device in which a first resin-encapsulated package

Details Semiconductor device in which a first resin-encapsulated package Semiconductor device in which a first resin-encapsulated package

1996-11-12

1998-10-20

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257666, 257672, 257675, 257676, 257686, 257690, 257698, H01L 2504, H01L 2510

Patent

active

058250824

ABSTRACT:
A semiconductor device in which a control element is buffered from the effect caused by a power element whose heating value is greater than that of the control element, so as to provide the semiconductor device of multiple-chip configuration and having stable operating characteristics within a guaranteed range. The semiconductor device includes: a first resin unit including a first package having a plurality of a semiconductor elements therein; a support member which is projected from the first unit; and a second unit including a second resin package having at least one semiconductor element therein, whereby the second unit is disposed over the first unit by way of the support member, wherein the first unit has a lead insertion hole so that a lead extending from the second resin package in the second unit is electrically connected to the first resin package in the first unit, and the top surface of the support member is in contact with the bottom face of the second resin package so that there is provided a space between the first and second resin packages to buffer by heat generated by the semiconductor elements in the first resin package.

REFERENCES:
patent: 5138437 (1992-08-01), Kumamoto et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5648683 (1997-07-01), Tazkahashi

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