Semiconductor device having window-frame flag with tapered edge

Details Semiconductor device having window-frame flag with tapered edge Semiconductor device having window-frame flag with tapered edge

1992-07-27

1993-08-03

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 2312

Patent

active

052332225

ABSTRACT:
A semiconductor device (30) utilizes a lead frame (32) having a window-frame flag (36). An opening (44) within the flag creates an interior edge (46) which is tapered, preferably to an angle .phi. that is between 55.degree. and 65.degree.. The tapered interior edge reduces boundary-layer separation of a resin molding compound during formation of a resin package body (42). Thus, voids in the resin packaging material near the interior edge of the flag are less likely to be formed.

REFERENCES:
patent: 4797726 (1989-01-01), Manabe et al.
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4884124 (1989-11-01), Mori et al.
patent: 4918511 (1990-04-01), Brown
patent: 4924291 (1990-05-01), Lesk et al.
patent: 4942452 (1990-07-01), Kitano et al.
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5150193 (1992-09-01), Yasuhara et al.

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