Semiconductor device having upper and lower package bodies and m

Details Semiconductor device having upper and lower package bodies and m Semiconductor device having upper and lower package bodies and m

1996-02-16

1997-08-12

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257704, 257730, 257796, H01L 2312, H01L 2304, H01L 2328

Patent

active

056568649

ABSTRACT:
A semiconductor device in which molding resin is not adhered on test pads of leads extending from a junction of an upper package half-body and a lower package half-body. The semiconductor device can effectively release heat generated by a semiconductor chip molded in a package of the semiconductor device. The semiconductor device includes a semiconductor chip having a plurality of leads connected thereto. A package of the semiconductor device is formed by means of molding. The package is constructed of a first package portion and a second package portion integrally formed into one package. The first package portion has a horizontal section smaller than that of the second package portion so that a portion of each of the leads extends from a part of the package between the first package portion and the second package portion and is exposed on a surface of the second package portion. The semiconductor chip is positioned within the second package portion. A supporting member is provided in the second package portion for supporting the portion of each of the leads and is located inside the second package portion so as to prevent deformation of the leads during molding of the package.

REFERENCES:
patent: 3585272 (1971-06-01), Shatz
patent: 5223739 (1993-06-01), Katsumata et al.
patent: 5378924 (1995-01-01), Liang

Affiliated with

Also associated with

Rating

Semiconductor device having upper and lower package bodies and m does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having upper and lower package bodies and m, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having upper and lower package bodies and m will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-162298