Semiconductor device having universal low-stress die support and

Details Semiconductor device having universal low-stress die support and Semiconductor device having universal low-stress die support and

1993-03-22

1994-07-05

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257674, 437220, H01L 2348

Patent

active

053270088

ABSTRACT:
A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many different die sizes. In another embodiment, a semiconductor device (45) includes a lead frame (40) having a mini-flag (42) to accomplish these same objectives.

REFERENCES:
patent: 4289922 (1981-09-01), Devlin
patent: 4612564 (1986-09-01), Moyer
patent: 4868635 (1989-09-01), Frechette et al.
patent: 4924291 (1990-05-01), Lesk et al.
patent: 4994895 (1991-02-01), Matsuzaki et al.

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