Semiconductor device having two staggered lead frame stages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Details

257692, 257736, H01L 23495

Patent

active

055571433

ABSTRACT:
A semiconductor device includes a package containing a semiconductor element disposed on a die pad, and a plurality of leads extending from an inside of the package to an outside of the package. The plurality of leads are arranged up and down in a staggered manner, an interval between ends of lower stage leads in the package is narrower than a width of upper stage leads, and ends of the lower stage leads in the package are positioned nearer to the die pad than ends of the upper stage leads.

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