Semiconductor device having through contact blocks with...

Details Semiconductor device having through contact blocks with... Semiconductor device having through contact blocks with...

2007-02-02

2009-12-15

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S692000

Reexamination Certificate

active

07633141

ABSTRACT:
The stackable semiconductor device includes at least one first electrode on a top side and a large-area second electrode on an underside of a semiconductor chip. The semiconductor chip also includes a control electrode on one of: the top side or the underside. Through contact blocks are arranged on the edge sides of the semiconductor device, the through contact blocks including externally accessible external contact areas. The external contact area each includes at least one edge side contact area, a top side contact area and an underside contact area. At least one large-area external contact is arranged on the underside and/or on the top side of the semiconductor device.

REFERENCES:
patent: 5115300 (1992-05-01), Yanagida et al.
patent: 6165820 (2000-12-01), Pace
patent: 6249041 (2001-06-01), Kasem et al.
patent: 6873041 (2005-03-01), Crowley et al.
patent: 6979843 (2005-12-01), Nakajima et al.
patent: 2004/0089934 (2004-05-01), Shimoida et al.

Affiliated with

Also associated with

Rating

Semiconductor device having through contact blocks with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having through contact blocks with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having through contact blocks with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4098111