Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-01-25
2000-02-08
Guay, John
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257717, H01L 2334
Patent
active
060230983
ABSTRACT:
A semiconductor device includes a wiring board, an electronic component supported by the wiring board, a heat conduction layer provided in the wiring board so as to be in contact with the electronic component, and terminals provided on the wiring board and thermally connected to the heat conduction layer through thermal vias provided in the wiring board. Heat generated by the electronic component conducts to the terminals through the heat conduction layer and then conducts to a circuit board on which the semiconductor device is placed.
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Higashiguchi Yutaka
Inagaki Mitsuo
Kumai Toshio
Ochiai Ryoichi
Totani Makoto
Fujitsu Limited
Guay John
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