Semiconductor device having tape automated bonding (TAB) leads w

Details Semiconductor device having tape automated bonding (TAB) leads w Semiconductor device having tape automated bonding (TAB) leads w

1991-05-31

1992-07-21

Hille, Rolf

357 69, H01L 2354, H01L 2348

Patent

active

051327724

ABSTRACT:
A semiconductor device (20) has a plurality of TAB leads (28) which facilitate lead bonding. The device is comprised of a semiconductor die (22) having a plurality of bonding pads (24) located thereon. On each of the bonding pads is a bump (26). Bonded to each of the bumps is a TAB lead (28) which has a recessed portion, such as a hole (30). The recessed portion or hole is placed over a protrusion of the bump, for example a tail of a ball bump, such that the lead is guided into the appropriate position relative to the bump during lead bonding, thereby preventing misalignment. The presence of the recessed portion in the lead also eliminates the need to flatten bumps prior to lead bonding.

REFERENCES:
patent: 3519896 (1970-07-01), Kelley
patent: 3680206 (1972-08-01), Roberts
patent: 4862246 (1989-08-01), Masuda et al.

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