Semiconductor device having tape automated bonding leads

Details Semiconductor device having tape automated bonding leads Semiconductor device having tape automated bonding leads

1994-11-18

1997-08-05

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257763, 257764, 257735, 257736, H01L 23415, H01L 2348

Patent

active

056545843

ABSTRACT:
A plurality of electrode pads are formed on a main surface of a semiconductor chip. The electrode pads on the semiconductor chip are electrically connected to the top end of an inner lead through a metal plating layer.

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