Semiconductor device having tab tape lead frame with reinforced

Details Semiconductor device having tab tape lead frame with reinforced Semiconductor device having tab tape lead frame with reinforced

1997-10-09

1999-01-12

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257670, 257671, H01L 23495

Patent

active

058594710

ABSTRACT:
In a lead frame adapted to be used for a semiconductor device, a plurality of inner leads are made of a thin conductive material for easily forming a fine pattern of the inner leads. A plurality of outer leads are integrally formed with the respective inner leads. The outer leads are coated with metal layers to increase the thickness thereof, so that a desired strength of the outer leads is obtained. A semiconductor chip is electrically connected to the inner leads. The semiconductor chip and a part of the lead frame including the inner leads are hermetically sealed with a resin and, thus, a semiconductor device is obtained.

REFERENCES:
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 5311056 (1994-05-01), Wakabayashi et al.
Microelectronics Packaging Handbook, (Ed. Tummala and Rymaszewski), 1988, pp. 414-415.
Shibata et al., "Film Carrier Tape," Patent Abstracts of Japan, vol. 12, No. 49 (E-582) 13 Feb. 1988 & JP-A-62 196840 (Oki Electric IND CO LTD) 31 Aug. 1987.
Mizukami et al., "Electronics Device," Patent Abstracts of Japan, vol. 13, No. 44 (E-710) 31 Jan. 1989 & JP-A-63 293829 (Hitachi LTD) 5 Oct. 1988.
Saigo et al., "Leadframe and Its Manufacture," Patent Abstracts of Japan, vol. 14, No. 576 (E-1016) 21 Dec. 1990 & JP-A-02 250364 (TOPPAN Printing CO LTD) 8 Oct. 1990.
Yumoto et al., "Manufacture of Tab Tape," Patents Abstracts of Japan, vol. 16, No. 340 (E-1238) 3 Apr. 1992 & JP-A-04 102341 (Shinko Electric CO LTD) 3 Apr. 1992.

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