Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1997-07-29
2000-06-27
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438106, 438126, H01L 2144, H01L 2148, H01L 2150
Patent
active
060806044
ABSTRACT:
A semiconductor device having a semiconductor chip and a TAB lead adhering to a surface of the semiconductor chip by a TAB tape which electrically connects an internal terminal arranged in a center part of a surface of the semiconductor chip to an external terminal arranged around a periphery of the semiconductor chip. One embodiment according to the present invention is an LCO semiconductor device having the TAB lead connecting to a lead-frame assembled in an IC package. Another embodiment according to the present invention is a TAB tape of thermo-plasticity comprising a first surface having a first softening temperature and a second surface having a second softening temperature which is different from the first softening temperature.
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Collins Deven
Fujitsu Limited
Picardat Kevin M.
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