Semiconductor device having stacked semiconductor chips...

Details Semiconductor device having stacked semiconductor chips... Semiconductor device having stacked semiconductor chips...

2007-04-03

2007-04-03

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE23052, C257SE23079, C257SE25013, C257S686000, C257S685000, C257S689000, C257S784000, C257S777000, C257S728000, C257S725000, C257S786000, C257S698000

Reexamination Certificate

active

09964484

ABSTRACT:
The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.

REFERENCES:
patent: 5458617 (1995-10-01), Bystrom
patent: 5777345 (1998-07-01), Loder et al.
patent: 6087222 (2000-07-01), Jung Lin et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6261865 (2001-07-01), Akram
patent: 6291881 (2001-09-01), Yang
patent: 6307257 (2001-10-01), Huang et al.
patent: 6353265 (2002-03-01), Michii
patent: 6410987 (2002-06-01), Kanemoto et al.
patent: 6433421 (2002-08-01), Masuda et al.
patent: 6437449 (2002-08-01), Foster
patent: 6441495 (2002-08-01), Oka et al.
patent: 6458625 (2002-10-01), Akram
patent: 6483181 (2002-11-01), Chang et al.
patent: 6552416 (2003-04-01), Foster
patent: 6559526 (2003-05-01), Lee et al.
patent: 6573567 (2003-06-01), Nishizawa et al.
patent: 6580164 (2003-06-01), Ohie
patent: 6603072 (2003-08-01), Foster et al.
patent: 6700794 (2004-03-01), Vinson et al.
patent: 6744121 (2004-06-01), Chang et al.
patent: 6759307 (2004-07-01), Yang
patent: 6841858 (2005-01-01), Shim et al.
patent: 2001/0023994 (2001-09-01), Oka
patent: 2001/0040281 (2001-11-01), Butler
patent: 2001/0054759 (2001-12-01), Nishiura
patent: 2002/0017720 (2002-02-01), Nishizawa et al.
patent: 2002/0024146 (2002-02-01), Furusawa
patent: 2002/0027266 (2002-03-01), Wada et al.
patent: 2002/0030270 (2002-03-01), Nishizawa et al.
patent: 2002/0084519 (2002-07-01), Choi et al.
patent: 2002/0088633 (2002-07-01), Kong et al.
patent: 2002/0102763 (2002-08-01), Masuda et al.
patent: 2002/0109222 (2002-08-01), Lai et al.
patent: 2002/0109237 (2002-08-01), Oka
patent: 2002/0145190 (2002-10-01), Fernandez
patent: 2002/0153599 (2002-10-01), Chang et al.
patent: 2002/0158316 (2002-10-01), Lee et al.
patent: 2002/0180020 (2002-12-01), Lin et al.
patent: 2002/0180021 (2002-12-01), Lin et al.
patent: 2003/0006490 (2003-01-01), Kawaishi
patent: 2003/0020177 (2003-01-01), Oka
patent: 2003/0038356 (2003-02-01), Derderian
patent: 2003/0057566 (2003-03-01), Huang et al.
patent: 2003/0137042 (2003-07-01), Mess et al.
patent: 2004/0033673 (2004-02-01), Cobbley et al.
patent: 2-5455 (1990-01-01), None
patent: 5-343609 (1993-12-01), None

Affiliated with

Also associated with

Rating

Semiconductor device having stacked semiconductor chips... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having stacked semiconductor chips..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having stacked semiconductor chips... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3755033