Semiconductor device having stacked lead structure

Details Semiconductor device having stacked lead structure Semiconductor device having stacked lead structure

1991-06-18

1993-10-12

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257692, 257691, 257677, H01L 2302

Patent

active

052528545

ABSTRACT:
Disclosed is a resin-molded type semiconductor device having a thin package while avoiding short-circuit of wires with a common inner lead. In the construction thereof, a common inner lead constituted by a thin metal sheet is fixed onto a circuit-forming surface of a rectangular semiconductor chip substantially in parallel with longer sides of the chip and substantially in a central region of the chip, and a plurality of inner leads for signals, which are in the form of a frame, are stacked and fixed onto the common inner lead; then these components are molded with resin.

REFERENCES:
patent: 4862254 (1989-08-01), Pashby et al.
patent: 4965654 (1990-10-01), Karner et al.
patent: 5122858 (1992-06-01), Mahulikar et al.

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