Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2006-11-13
2009-06-09
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S618000, C257S774000, C257S777000, C257S698000, C257SE21597
Reexamination Certificate
active
07545035
ABSTRACT:
A semiconductor device includes several assembled integrated-circuit chips. A main integrated-circuit chip has at least one cavity in which electrical contacts are provided. A secondary integrated-circuit chip includes an edge which engages in the cavity of the main chip and has electrical contacts. When the secondary integrated-circuit chip is inserted into the cavity, the electrical contacts of the main chip and the electrical contacts of the secondary chip are placed so as to be in contact with one another.
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Preliminary French Search Report, FR 05 11544, dated Jun. 21, 2006.
Gardere Wynne & Sewell LLP
Parekh Nitin
STMicroelectronics S.A.
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