Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2007-07-10
2010-06-29
Malsawma, Lex (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S660000, C257SE23114, C257SE23115
Reexamination Certificate
active
07745910
ABSTRACT:
A semiconductor device has a substrate comprising at least one dielectric layer and at least one metal layer on a first surface of the substrate. A die is attached to the first surface of the substrate. A mold compound is used to encapsulate the die and partially encapsulate the first surface of the substrate. The mold compound has a protrusion proximate to the at least one metal layer. A conductive material covers the mold compound, including the protrusion, and contacts the at least one metal layer.
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Berry Christopher J.
Olson Timothy L.
Scanlan Christopher M.
Amkor Technology Inc.
Malsawma Lex
Weiss & Moy P.C.
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