Semiconductor device having resin-sealed area on circuit...

Details Semiconductor device having resin-sealed area on circuit... Semiconductor device having resin-sealed area on circuit...

2007-09-11

2007-09-11

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S735000, C257SE23066

Reexamination Certificate

active

11447148

ABSTRACT:
A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also restrains the occurrence of disconnection caused by a wiring layer being crushed. In the semiconductor device, the sealing resin for sealing the semiconductor chip is molded on the circuit board that has a plurality of wiring patterns and a solder resist for insulatively covering the wiring patterns formed on the front surface thereof, the interval of the wiring patterns is set to range from 50% to 200% of its adjacent interval in a molding line area of the sealing resin.

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