Semiconductor device having peripheral metal wiring

Details Semiconductor device having peripheral metal wiring Semiconductor device having peripheral metal wiring

1994-10-06

1996-02-13

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular power supply distribution means

257211, 257758, 257920, H01L 23485, H01L 2940

Patent

active

054913527

ABSTRACT:
At a peripheral area of a semiconductor chip where active elements are not formed, a layer underlying a power supply wiring or ground wiring is provided with an uneven surface. The uneven or corrugated surface at the interface between the wiring and the underlying layer makes the wiring unsusceptible to slide. The uneven surface can be realized by interposing foreign matters between insulating layers, by selectively reducing the thickness of an insulating layer, or by forming openings in an insulating layer.

REFERENCES:
patent: 4914503 (1990-04-01), Shirato et al.
patent: 5117280 (1992-05-01), Adachi
patent: 5287002 (1994-02-01), Freeman, Jr. et al.

Affiliated with

Also associated with

Rating

Semiconductor device having peripheral metal wiring does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having peripheral metal wiring, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having peripheral metal wiring will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-242426