Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent
1998-05-01
2000-12-19
Williams, Alexander O.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
257698, 257728, 257724, 257712, 257796, 257693, 257786, 257784, 257774, 257675, 257787, H01L 2334, H01L 2312, H01L 2328, H05K 118
Patent
active
061630691
ABSTRACT:
Provide a discrete semiconductor device, particularly a discrete semiconductor device for small signal operation with a smaller packaging area and has excellent high frequency characteristics and good heat dissipation performance, and a method for producing the same. The discrete semiconductor elements are mounted on die bond pads and wire bond pads with the packaging surface being sealed with a resin, and connecting the back faces of the die bond pads and the wire bond pads directly to a mother board.
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Fujihara Teruhisa
Ohgiyama Kenji
Oohira Minoru
Mitsubishi Denki & Kabushiki Kaisha
Williams Alexander O.
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