Semiconductor device having packaging structure

Details Semiconductor device having packaging structure Semiconductor device having packaging structure

2006-10-17

2006-10-17

Mayo, William H. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S260000, C174S539000, C174S564000, C257S738000

Reexamination Certificate

active

07122748

ABSTRACT:
There is provided a semiconductor device comprising a semiconductor chip whose main surface comprises first electrode pads; a wiring portion electrically connected to the electrode pad and including a bump portion that protrudes upward in a vertical direction with respect to the main surface; a sealing layer covering the perimeter and main surface of the chip; and a re-distribution wiring layer which electrically connected to the wiring portion and extending from a first portion of the sealing layer over the main surface to a second region of the sealing layer outside the first region.

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Nikkei Microdevices, Feb. 1999, p. 48-57—Not in English.
Nikkei Microdevices, Feb. 2000, p. 50-53 —Not in English.
Amkor Technology etCSP™, 2000, See Internet URL: http://www.amkor.com/Products/all—products/etcsp.cfm.

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