Semiconductor device having offsetchips

Details Semiconductor device having offsetchips Semiconductor device having offsetchips

1997-02-18

1998-06-30

Arroya, Teresa Maria

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257723, 257777, H01L 2348, H01L 2334

Patent

active

057738963

ABSTRACT:
A semiconductor device comprises a square-shaped first semiconductor chip having a first LSI, a square-shaped second semiconductor chip having a second LSI, which is smaller in size than the first semiconductor chip and connected to the first semiconductor chip by face down bonding, and a square-shaped package made of a molding resin for packaging the first and second semiconductor chips. The respective centers of the first and second semiconductor chips are offset from each other, while the center of the second semiconductor chip is substantially coincident with the center of the molding resin.

REFERENCES:
patent: 5239447 (1993-08-01), Coutues et al.
patent: 5473196 (1995-12-01), De Givry

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