Semiconductor device having noise reducing die pads

Details Semiconductor device having noise reducing die pads Semiconductor device having noise reducing die pads

1991-08-12

1993-07-20

Epps, Georgia Y.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257666, H01L 2302, H01L 2312

Patent

active

052298469

ABSTRACT:
In a semiconductor device including a semiconductor chip, a lead frame with a die pad and plural leads, and a sealing body. The die pad is divided into a plurality of small pieces, and at least one of the plural divided pieces is electrically connected to at least one lead to which a potential is applied. Since the divided die pad is used as a wiring lead, the inductance and resistance of the voltage supply line or the ground line within the chip can be reduced, thus reducing the occurrence of supply voltage and output noise for prevention of erroneous operation.

REFERENCES:
patent: 4725692 (1988-02-01), Islii et al.

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