Semiconductor device having multistepped bump terminal electrode

Details Semiconductor device having multistepped bump terminal electrode Semiconductor device having multistepped bump terminal electrode

1976-06-09

1977-09-27

James, Andrew J.

357 65, 357 68, 357 69, H01L 2348, H01L 2946, H01L 2954

Patent

active

040515087

ABSTRACT:
A terminal electrode for a semiconductor device includes a bump terminal comprising first, second, and third metal layers producing a step-like profile. The bump terminal is characterized by improved mechanical strength for gang bonding.

REFERENCES:
patent: 3442012 (1969-05-01), Murray
patent: 3501681 (1970-03-01), Weir
patent: 3514379 (1970-05-01), Neill
patent: 3585461 (1971-06-01), Eynon
patent: 3617818 (1971-11-01), Fuller
patent: 3751292 (1973-08-01), Kongable
patent: 3765970 (1973-10-01), Athanas et al.
patent: 3942187 (1976-03-01), Gelsing et al.

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