Semiconductor device having metal plates and semiconductor chip

Details Semiconductor device having metal plates and semiconductor chip Semiconductor device having metal plates and semiconductor chip

2007-05-08

2007-05-08

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S719000

Reexamination Certificate

active

10972475

ABSTRACT:
A semiconductor device includes: a semiconductor chip; a first metal plate disposed on one side of the chip through a first solder layer; a second metal plate disposed on the other side of the chip through a second solder layer; a third metal plate disposed on the second metal plate through a third solder layer; supporting means for holding at least one of distances between the chip and the first metal plate and between the chip and the second metal plate; and excess solder accommodation means for accommodating excess solder in a case where the third solder layer includes the excess solder.

REFERENCES:
patent: 5471366 (1995-11-01), Ozawa
patent: 5786635 (1998-07-01), Alcoe et al.
patent: 6208156 (2001-03-01), Hembree
patent: 6773963 (2004-08-01), Houle
patent: 6791181 (2004-09-01), Horie et al.
patent: 2003/0022464 (2003-01-01), Hirano et al.
patent: A-S58-182256 (1983-10-01), None
patent: 4066006949 (1994-01-01), None
patent: A-H07-226422 (1995-09-01), None
First Office Action from Chinese Patent Office issued on Aug. 11, 2006 for the corresponding Chinese patent application No. 200410087755.6 (a copy and English translation theerof).

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