Semiconductor device having metal lines with slits

Details Semiconductor device having metal lines with slits Semiconductor device having metal lines with slits

2011-01-04

2011-01-04

Smith, Bradley K (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S750000

Reexamination Certificate

active

07863746

ABSTRACT:
A semiconductor device including a semiconductor substrate, an integrated circuit on the semiconductor substrate, an insulation layer covering the integrated circuit, and a plurality of metal line patterns on the insulation layer. First and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.

REFERENCES:
patent: 4467345 (1984-08-01), Ozawa
patent: 4835591 (1989-05-01), Matsukawa
patent: 5229642 (1993-07-01), Hara et al.
patent: 5329162 (1994-07-01), Nadaoka
patent: 5382831 (1995-01-01), Atakov et al.
patent: 6091628 (2000-07-01), Kim
patent: 10-84059 (1998-03-01), None
patent: 10-1999-0026137 (1999-04-01), None
patent: 10-2000-0033091 (2000-06-01), None

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