Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1998-02-27
2000-02-08
Graybill, David E.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257729, 257787, 257788, 257790, H01L 2308, H01L 2310, H01L 2314
Patent
active
060230967
ABSTRACT:
A semiconductor device with a metal foil and a sealing resin material. Metal foil is formed integrally with the sealing resin layer.
Hotta Yuji
Mochizuki Amane
Sakamoto Michie
Yoshioka Masahiro
Graybill David E.
Nitto Denko Corporation
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