Semiconductor device having many lead pins

Details Semiconductor device having many lead pins Semiconductor device having many lead pins

1993-12-10

1995-12-12

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257692, 257698, H01L 2302, H01L 2312, H01L 2348, H01L 2944

Patent

active

054752612

ABSTRACT:
A semiconductor device includes a predetermined number of surface mount first lead pins (14), arranged around the periphery of the underside of a package (13) fitted with a chip (11). A predetermined number of second lead pins (22, 41), each having a specific function, are provided in a region near the center of the underside of the package (13) inside of the region populated with the first lead pins (14).

REFERENCES:
patent: 4530002 (1985-07-01), Kanai
patent: 5102829 (1992-04-01), Cohn
patent: 5107329 (1992-04-01), Okinaga et al.
Patent Abstracts of Japan, vol. 12, No. 60 (E-584) 23 Feb. 1988 & JP-A-62 202 544 (Mitsubishi Electric Corp.).

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