Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Patent
1998-10-19
2000-08-01
Abraham, Fetsum
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
257660, 257661, 257676, 257687, 257700, H05K 100
Patent
active
060970804
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a semiconductor device capable of providing a magnetic shield against a semiconductor chip including inductor conductors formed on a substrate.
BACKGROUND ART
Coils are generally essential circuit constituent parts and are indispensable parts for some circuits to be constituted. For example, oscillation circuits utilizing LC resonance or tuning circuits contained in a transmitter-receiver could not be implemented without using the coils.
However, the coils contained in the circuit generate magnetic fluxes, so that there is a need for such a design as to prevent the magnetic fluxes from affecting the surrounding components. For example, two coils must be disposed away from each other on a printed wiring board, or if approximate arrangement of a plurality of coils is desired, the direction of the magnetic fluxes must be allowed for in order to ensure a proper arrangement.
FIG. 5 illustrates three coils adjacent to one another, with the direction of the arrangement contrived. As shown in the diagram, the three coils are arranged in such a manner that two adjacent coils are disposed at 90 degrees relative to each other so as to allow magnetic fluxes generated from the adjacent coils to be orthogonal to each other. By allowing the magnetic fluxes generated from the adjacent coils to be orthogonal to each other in this manner, it is possible to suppress the magnetic coupling between the coils to a minimum.
By the way, such a conventional method allowing the magnetic fluxes to be orthogonal to each other as a result of the contrived direction of arrangement of the coils to minimize the magnetic coupling between the coils, is limited to the case where the coils are arranged on the printed wiring board.
In case spirally shaped inductor conductors are formed on the semiconductor substrate by use of a thin film formation techniques, the direction of generation of the magnetic fluxes is limited to the direction orthogonal to the semiconductor substrate. For this reason, the adjacently shaped coils in the form of inductor conductors are magnetically coupled with one another, so that it is inconvenient when it is desired that they be electrically separated as circuit elements. In particular, in cases where passive elements such as inductor conductors together with various active elements are formed on the semiconductor substrate, it is typical to reduce the size of the entire circuit by using the semiconductor fabrication technique, with the result that it becomes difficult to arrange in a fully separate manner a plurality of inductor conductors contained in the circuit.
FIG. 6 is a diagram for explaining the state of the magnetic fluxes generated from the semiconductor circuit containing inductor conductors formed on the semiconductor substrate. When a current flows into the inductor conductors within the semiconductor circuit shown in the diagram, magnetic fluxes occur in the direction substantially orthogonal to the surface of the semiconductor substrate as indicated by an arrow a of the diagram. These magnetic fluxes affect the actions of the other semiconductor elements formed on the semiconductor substrate, often causing noises or malfunctions.
DISCLOSURE OF THE INVENTION
The present invention was conceived in view of the above respects. It is therefore the object of the present invention to provide a semiconductor device capable of minimizing a magnetic influence, on the outside, of a semiconductor chip including inductor conductors formed on a substrate.
In the semiconductor device of the present invention, the semiconductor chip mounted on the substrate and including inductor conductors is covered by shielding members formed on both sides of the substrate in such a manner as to include the interior of through holes. This allows magnetic fluxes generated from a circuit formed on the semiconductor chip to circulate within the shielding members, preventing the magnetic fluxes from leaking out to the exterior of the shielding members.
In particular, in cases w
REFERENCES:
patent: 5151770 (1992-09-01), Inoue
patent: 5151771 (1992-09-01), Hiroi et al.
patent: 5286926 (1994-02-01), Kimura et al.
Patent Abstracts of Japan, vol. 017, No. 504 (E-1430) Sep. 10, 1993, JP-A-05 129 793 (Abstact) May 25, 1993.
Nakanishi Tsutomu
Okamoto Akira
Abraham Fetsum
Susumu Okamura
Takeshi Ikeda
LandOfFree
Semiconductor device having magnetic shield layer circumscribing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having magnetic shield layer circumscribing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having magnetic shield layer circumscribing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-666703