Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Patent
1992-04-17
1994-06-14
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
257623, 257452, H01L 2906
Patent
active
053213033
ABSTRACT:
A method for manufacturing a semiconductor device using inclined stage of a dicing saw in order to cut the semiconductor substrate obliquely with respect to the depthwise direction. When a plurality of semiconductor chips diced obliquely are connected, a degree of connecting accuracy is increased, and it is possible to realize a contact-type image sensor of high resolving power and high accuracy.
REFERENCES:
patent: 3484713 (1964-04-01), Fenner
patent: 4016590 (1977-04-01), Baur et al.
patent: 4063271 (1977-12-01), Bean et al.
Kawahara Yukito
Machida Satoshi
Mukainakano Hiroshi
Adams Bruce L.
James Andrew J.
Monin D.
Seiko Instruments Inc.
Wilks Van C.
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