Semiconductor device having intermediate layer for pinching off

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 52, 357 58, 357 22, A01L 2948

Patent

active

050179764

ABSTRACT:
A semiconductor device comprising a semiconductor substrate having two major surfaces a cathode electrode film formed on the first major surface of the substrate, and an anode electrode film formed on the second major surface of the substrate. The substrate is formed of an N.sup.+ -type layer formed on the cathode electrode film, an N.sup.- -type layer formed on the N.sup.+ -type layer, and N.sup.-- -type layer formed on the N.sup.- -type layer and having an impurity concentration lower than that of the N.sup.- -type layer, and an N.sup.- -type layer interposed between the N.sup.-- -type layer and the anode electrode film. The device further comprises a plurality of P.sup.+ -type areas formed in the second major surface of the substrate, contacting the anode electrode film and extending through the N.sup.- -type layer and the N.sup.-- -type layer into the N.sup.- -type layer. When a forward bias is applied to the device, a current flows from the anode electrode film, passes through the N.sup.- -, N.sup.-- -, N.sup.- - and the N.sup.+ -type layers, and flows out of the cathode electrode film. When a reverse bias is applied to the device, the depletion layer formed around the junction between each P.sup.+ -type area and the N.sup.-- -type layer extends, and joins with the similar depletion layers, thereby pinching off the current path. As a result, the reverse leakage current is reduced.

REFERENCES:
patent: H40 (1986-04-01), Buchanan, Jr. et al.
patent: 3982264 (1976-09-01), Ishitani
patent: 4134123 (1979-01-01), Shannon
patent: 4641174 (1987-02-01), Baliga
patent: 4796069 (1989-01-01), Anantha et al.
patent: 4862229 (1989-08-01), Mundy et al.
Patent Abstracts of Japan, vol. 5, No. 91 (E-61) [763], p. 17 E 61, dated Jun. 13, 1981.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device having intermediate layer for pinching off does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having intermediate layer for pinching off , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having intermediate layer for pinching off will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-242179

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.