Semiconductor device having integral structure of case and exter

Details Semiconductor device having integral structure of case and exter Semiconductor device having integral structure of case and exter

1995-05-16

1997-11-11

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257703, 257668, 257698, 257697, 257707, 257723, 257725, 257712, H01L 2507, H01L 2312, H01L 2518

Patent

active

056867581

ABSTRACT:
It is an object of the present invention to obtain a power semiconductor device with small size and high reliability in power semiconductor devices having integral structure of case and external connection terminals. A dummy pad (42) having no electric connection with other parts is provided and a terminal end of a connecting wire (46) connecting by sequentially bonding an exposed surface of a connection electrode (43) and a bonding pad (41) of a semiconductor element (40) is bonded thereto. The semiconductor device can be miniaturized without deteriorating electric characteristics and reliability of the semiconductor elements.

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patent: 5521437 (1996-05-01), Oshima et al.
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Patent Abstracts of Japan, vol. 17, No. 219 (E-1358), Apr. 30, 1993, JP-A-4 354360, Dec. 8, 1992.
Patent Abstracts of Japan, vol. 14, No. 408 (E-972), Sep. 4, 1990, JP-A-2 154457, Jun. 13, 1990.

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