Semiconductor device having inner leads extending over a surface

Details Semiconductor device having inner leads extending over a surface Semiconductor device having inner leads extending over a surface

1990-05-29

1992-06-30

Hille, Rolf

357 68, H01L 2348, H01L 2312, H01L 2350

Patent

active

051268213

ABSTRACT:
According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

REFERENCES:
patent: 3444440 (1969-05-01), Bell et al.
patent: 3708730 (1973-01-01), Schierz et al.
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer
patent: 4937656 (1990-06-01), Kohara
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 4989068 (1991-01-01), Yasuhara et al.

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