Semiconductor device having inner lead arrangement with enhanced

Details Semiconductor device having inner lead arrangement with enhanced Semiconductor device having inner lead arrangement with enhanced

1992-12-22

1994-07-19

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053312015

ABSTRACT:
A resin-sealed semiconductor device comprising a semiconductor chip having pad electrodes formed on a circuit forming surface in the interior of the main surface and inner leads cemented to the semiconductor chip through an insulator for electric insulation such that ends of the inner leads reach the edge of the circuit forming surface of the semiconductor chip, wherein common conductors, which are connected with at least one of power supplying inner leads and/or grounding inner leads, and at least one of the inner leads are coupled on the semiconductor chip, and wherein the configuration of the common conductors and the inner leads coupled together is virtually L-shaped, T-shaped, -shaped, or cross-shaped.

REFERENCES:
patent: 5115298 (1952-05-01), Loh
patent: 5164815 (1992-11-01), Lim
patent: 5206536 (1993-04-01), Lim

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