Semiconductor device having improved interconnection wiring stru

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With means to prevent contact from penetrating shallow pn...

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Details

257765, 257771, 257637, H01L 2348, H01L 2946, H01L 2954, H01L 2962

Patent

active

054061210

ABSTRACT:
Disclosed herein is a semiconductor device having a substrate, an insulating layer covering the substrate, a plurality of wiring layer formed on the insulating layer, each wiring layer having a top surface and a side surface, and a sidewall insulating film formed on and along the side surface of each of the wiring layers. The sidewall insulating film suppresses a hillock projecting from the side surface of each wiring layer.

REFERENCES:
patent: 4561009 (1985-12-01), Yonezawa et al.
patent: 5040048 (1991-08-01), Yasue
patent: 5061985 (1991-10-01), Meguro et al.
patent: 5075762 (1991-12-01), Kondo et al.

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