Semiconductor device having improved element arrangement strong

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 231, 357 41, 357 51, 357 65, H01L 2348, H01L 2702, H01L 2701

Patent

active

051052563

ABSTRACT:
A semiconductor device having a high density structure and resistant against external abnormal electric charges is disclosd. The semiconductor device comprises an input diffusion resistor coupled to an external terminal and formed in a semiconductor substrate, a diffusion region formed in the semiconductor substrate and a voltage wiring having a contact portion connected to the diffusion region through at least one contact hole formed in an insulating layer covering the diffusion region. A first distance between a first end of the diffusion region close to the diffusion resistor and a first part of the contact portion nearest to the first end is made larger than a distance between a second end opposite to the first end of the diffusion region and a second part of the contact portion nearest to the second end.

REFERENCES:
patent: 4692781 (1987-09-01), Rounhra et al.
patent: 4757368 (1988-07-01), Masunaga et al.
patent: 4785343 (1988-11-01), Nezh
patent: 4803527 (1989-02-01), Hatta et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device having improved element arrangement strong does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having improved element arrangement strong , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having improved element arrangement strong will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2353464

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.