Semiconductor device having improved adhesive structure and meth

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

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Details

257680, 257704, 257701, 257710, H01L 2310

Patent

active

052784290

ABSTRACT:
A semiconductor device includes a package, a semiconductor chip provided on the package, an intermediate layer formed on the package, an adhesive layer formed on the intermediate layer, and a lid formed on the adhesive layer and sealing the semiconductor chip. The intermediate layer contains a major component which is the same as a major component of the package.

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patent: 4827082 (1989-05-01), Horiuchi et al.
Patent Abstracts of Japan, vol. 11, No. 195 (E-518) (2642), Jun. 23, 1987, JP-A-62-022459.
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Patent Abstracts of Japan, vol. 11, No. 130 (E-502) (2577), Apr. 23, 1987, JP-A-61-276239.
Patent Abstracts of Japan, vol. 11, No. 88 (E-490), Mar. 18, 1987, JP-A-61-241952.

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