Patent
1986-05-12
1989-01-03
Edlow, Martin H.
357 30, 357 68, 357 71, 357 19, H01L 2714, H01L 2348, H01L 2504, H01L 3112
Patent
active
047960841
ABSTRACT:
A semiconductor device is disclosed with a conductive on-chip shield film formed on its surface. The on-chip shield film is patterned in a manner substantially complementary to the pattern of the wiring layer of the semiconductor device so that the shield film does not cover portions of the semiconductor device which are covered by the wiring-pattern layer. In this manner, the on-chip shield film of the semiconductor device provides high resistance to electrostatic and electromagnetic induction while maintaining the ability of the device to withstand changes in ambient temperature.
Dengo Tadao
Fukuda Ikuo
Kamasaki Keiji
Motojima Hideaki
Edlow Martin H.
Josephs David R.
Kabushiki Kaisha Toshiba
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