Semiconductor device having high-density packaging thereof

Details Semiconductor device having high-density packaging thereof Semiconductor device having high-density packaging thereof

2001-11-09

2003-10-21

Wallerson, Mark (Department: 2622)

Facsimile and static presentation processing

Facsimile

Auxiliary signal

C358S482000, C358S513000, C257S684000

Reexamination Certificate

active

06636334

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device and a method of fabricating the same. More particularly, the present invention relates to a thin semiconductor device that permits high-density packaging, and a method of fabricating the semiconductor device.
2. Description of the Related Art
A conventional semiconductor device is constructed by fixing a semiconductor IC chip to a wiring board with an adhesive, electrically connecting bond pads of the semiconductor IC chip to bond pads formed on the wiring board with metal wires, and sealing the semiconductor IC chip and the metal wires in a resin for protection.
When fabricating this conventional semiconductor device, the semiconductor IC chip is fixed to the wiring board with the adhesive, the bond pads of the semiconductor IC chip are electrically connected to the bond pads of the wiring substrate using metal wires, and the semiconductor IC chip and the metal wires are covered with and sealed in the resin.
The conventional technique, however, has the following problems. The respective thicknesses of the semiconductor IC chip and the layer of the adhesive bonding the semiconductor IC chip to the wiring substrate are included in the thickness of the semiconductor device, which makes it difficult to form the semiconductor device in a small thickness.
The area of the layer of the adhesive is greater than that of the semiconductor IC chip, and the layer of the adhesive spreads in an unpredictable shape when compressed between the semiconductor IC chip and the wiring board. Therefore, the bond pads of the wiring board to which the bond pads of the semiconductor IC chip are to be connected by the metal wires must be spaced from the periphery of the semiconductor IC chip by, for example, 8 mm or above, which makes high-density packaging difficult.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a thin semiconductor device that enables permitting high-density packaging thereof.
With the foregoing object, the present invention provides a semiconductor device comprising a semiconductor IC chip provided on its first surface with bond pads; a wiring substrate provided with a through hole extending between its first surface and its second surfaces opposed to the first surface; conductive members electrically connecting the bond pads of the semiconductor IC chip to conductive lines formed on the wiring substrate; and a resin molding covering the surface of the semiconductor IC chip and fixing side surface of the semiconductor IC chip to side surface of the through hole.


REFERENCES:
patent: 3536964 (1970-10-01), Lob et al.
patent: 4989063 (1991-01-01), Kolesar, Jr.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5138433 (1992-08-01), Hiruta
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5280192 (1994-01-01), Kryzaniwsky
patent: 5384689 (1995-01-01), Shen
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 5696666 (1997-12-01), Miles et al.
patent: 5723900 (1998-03-01), Kojima et al.
patent: 5723907 (1998-03-01), Akram
patent: 5739585 (1998-04-01), Akram et al.
patent: 5744862 (1998-04-01), Ishii
patent: 5763939 (1998-06-01), Yamashita
patent: 5798564 (1998-08-01), Eng et al.
patent: 5811879 (1998-09-01), Akram
patent: 5986339 (1999-11-01), Pai et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6153928 (2000-11-01), Cho
patent: 6163069 (2000-12-01), Oohira et al.
patent: 6336269 (2002-01-01), Eldridge et al.

Affiliated with

Also associated with

Rating

Semiconductor device having high-density packaging thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having high-density packaging thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having high-density packaging thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3152162