Semiconductor device having heat spreader with center opening

Details Semiconductor device having heat spreader with center opening Semiconductor device having heat spreader with center opening

2007-06-08

2011-11-15

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

C257S276000, C257S625000, C257S675000, C257S706000, C257S717000, C257SE23092

Reexamination Certificate

active

08058736

ABSTRACT:
The present invention provides a semiconductor device including: a semiconductor chip mounted on a substrate; a heat spreader provided above the semiconductor chip; and a sealing resin interposed between the semiconductor chip and the heat spreader and covering the semiconductor chip. The heat spreader is not in contact with any of the substrate and the semiconductor chip, and has an opening.

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Japanese Office Action dated Jul. 12, 2011 in corresponding Japanese Application No. 2007-145852 with English translation of enclosed lined portions of the Japanese Office Action.

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