Semiconductor device having first and second semiconductor chips

Details Semiconductor device having first and second semiconductor chips Semiconductor device having first and second semiconductor chips

1996-05-15

1998-03-03

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257676, 257668, 257735, H01L 23485, H05K 114

Patent

active

057242330

ABSTRACT:
A chip-on chip type semiconductor device is provided in which semiconductor chips provided in a package cannot be displaced during a transfer molding process so as to eliminate a short circuit. At least two lead frames are provided in and extend from the package so that the first semiconductor chip and the second semiconductor chip can be electrically connected to external devices. A die stage is provided between the first semiconductor chip and the second semiconductor chip. A bonding wire is provided for wiring between the first semiconductor chip and the lead frames, and TAB leads connect the second semiconductor chip to the lead frames. The lead frames may extend between the first and second semiconductor devices instead of the die stage. The lead frames may include one having a portion extending in a direction perpendicular to the longitudinal direction of the lead frames between the first and second semiconductor chips.

REFERENCES:
patent: 5331235 (1994-07-01), Chon
patent: 5479051 (1995-12-01), Waki et al.
patent: 5530292 (1996-06-01), Waki et al.

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