Semiconductor device having firmly secured heat spreader

Details Semiconductor device having firmly secured heat spreader Semiconductor device having firmly secured heat spreader

2005-06-27

2009-12-22

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S675000, C257S676000, C257SE23047, C438S124000, C438S127000

Reexamination Certificate

active

07635613

ABSTRACT:
A semiconductor device comprising a leadframe (903), which has first (903a) and second (903b) surfaces, a planar pad (910) of a certain size, and a plurality of non-coplanar members (913) adjoining the pad. The device further has a heat spreader (920) with first (920a) and second (920b) surfaces, a planar pad of a size matching the leadframe pad size, and contours (922), into which the leadframe members are inserted so that the first spreader pad surface touches the second leadframe pad surface across the pad size. A semiconductor chip (904) is mounted on the first leadframe pad surface. Encapsulation material (930), preferably molding compound, covers the chip, but leaves the second spreader surface uncovered.

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“Packaging: designing for thermal performance” Bruce M Guenin, May, 1997 (entire document).

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