Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-10-26
2009-06-30
Gurley, Lynne A. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S678000, C257S713000, C257SE23136
Reexamination Certificate
active
07554192
ABSTRACT:
A semiconductor device that includes an insulating substrate having an upper conductor formed on an upper surface thereof and a lower conductor formed on a lower surface of the insulating substrate. The device also includes a semiconductor element mounted on the upper surface of the insulating substrate with an under-element solder therebetween. The device further includes a heat sink whereon the insulating substrate is mounted with an under-substrate solder therebetween. The device additionally includes a silicone gel covering the semiconductor element, the under-element solder, and the upper conductor. In addition, the device includes a filler covering the lower conductor and the under-substrate solder, without covering the semiconductor element, the under-element solder, and the upper conductor, and having a thermal conductivity larger than a thermal conductivity of air and a fluidity higher than a fluidity of the silicone gel.
REFERENCES:
patent: 2002/0070439 (2002-06-01), Hiramatsu et al.
patent: 2002/0074146 (2002-06-01), Okubora
patent: 2004/0087057 (2004-05-01), Wang et al.
patent: 2005/0023033 (2005-02-01), Saiki et al.
patent: 63-96945 (1988-04-01), None
patent: WO 02/19423 (2002-03-01), None
U.S. Appl. No. 11/538,232, filed Oct. 3, 2006, Koga, et al.
Hayashida Yukimasa
Koga Masuo
Mizoshiri Tetsuo
Gurley Lynne A.
Mitsubishi Electric Corporation
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Webb Vernon P
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