Semiconductor device having external connection terminals...

Details Semiconductor device having external connection terminals... Semiconductor device having external connection terminals...

2011-05-17

2011-05-17

Stark, Jarrett J (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23023, C257SE21514, C438S106000

Reexamination Certificate

active

07944051

ABSTRACT:
In one embodiment, a semiconductor device has a semiconductor element made up of a semiconductor chip, first solder balls provided on the semiconductor chip and a BGA substrate on which the semiconductor chip is mounted via the first solder balls. Furthermore, the semiconductor device has external terminals on a surface of the BGA substrate opposing to a surface on which the semiconductor chip is mounted. The external terminals include oxide films provided with through holes.

REFERENCES:
patent: 6209196 (2001-04-01), Ozono et al.
patent: 6471115 (2002-10-01), Ijuin et al.
patent: 7514350 (2009-04-01), Hashimoto
patent: 2612071 (2004-04-01), None
patent: 11-204590 (1999-07-01), None
patent: 11-204926 (1999-07-01), None
patent: 2000-174059 (2000-06-01), None
patent: 2002-203872 (2002-07-01), None
Chinese patent Office issued a Chinese Office Action dated Aug. 28, 2009, Application No. 2008101440272.

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