Semiconductor device having electric contacts with precise resis

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357 65, 357 68, H01L 2702, H01L 2348

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active

047573686

ABSTRACT:
A semiconductor device includes a diffusion layer in the semiconductor substrate thereof; and an insulation layer is formed on the semiconductor substrate and is provided with a contact window therein, so as to electrically connect a conductive metal layer with the diffusion layer composed of Si atoms as a base material. A Si atom supplier is formed close to the contact window at the area where the Si atoms diffuse into the conductive metal layer. Preferably, the Si atom supplier comprises a dummy contact window similar to the above-mentioned real contact window.

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E. M. Hubacher et al, "Detecting Defects in Integrated Semiconductor Circuits" IBM Technical Disclosure Bulletin, vol. 14 (1972) pp. 2615-2617.
E. Berndlmaier, "Selectable Resistance Values for Integrated-Circuit Resistors", IBM Technical Disclosure Bulletin, vol. 19 (1977) pp. 4620-4621.
IBM Technical Disclosure Bulletin, "Reduced Electromigration Damage at Al Contacts to Si Integrated Circuits", by Joseph et al., vol. 15, No. 2, Aug. 1972, pp. 725-726.

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