Semiconductor device having dummy wiring layers and a method...

Details Semiconductor device having dummy wiring layers and a method... Semiconductor device having dummy wiring layers and a method...

2007-09-18

2007-09-18

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S776000

Reexamination Certificate

active

10999290

ABSTRACT:
A semiconductor device has first wiring layers30and a plurality of dummy wiring layers32that are provided on the same level as the first wiring layers30. The semiconductor device defines a row direction, and first virtual linear lines L1extending in a direction traversing the row direction. The row direction and the first virtual linear lines L1define an angle of 2-40 degrees, and the dummy wiring layers32are disposed in a manner to be located on the first virtual linear lines L1. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines L2extending in a direction traversing the column direction. The column direction and the second virtual linear lines L2define an angle of 2-40 degrees, and the dummy wiring layers32are disposed in a manner to be located on the second virtual linear lines L2.

REFERENCES:
patent: 4916514 (1990-04-01), Nowak
patent: 5357140 (1994-10-01), Kozasa
patent: 5556805 (1996-09-01), Tanizawa
patent: 5597668 (1997-01-01), Nowak
patent: 5790417 (1998-08-01), Chao
patent: 5798298 (1998-08-01), Yang
patent: 6225697 (2001-05-01), Iguchi
patent: 6528883 (2003-03-01), Dunham et al.
patent: 04-218918 (1992-08-01), None
patent: 9-153550 (1997-06-01), None
patent: 10-125681 (1998-05-01), None
patent: 10-335333 (1998-12-01), None
patent: 11-026576 (1999-01-01), None
patent: 2000-286263 (2000-10-01), None
patent: 2000-340568 (2000-12-01), None
patent: 2001-168205 (2001-06-01), None
Japanese Examination Report (No English).

Affiliated with

Also associated with

Rating

Semiconductor device having dummy wiring layers and a method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having dummy wiring layers and a method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having dummy wiring layers and a method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3725258