Semiconductor device having double side electrode structure...

Details Semiconductor device having double side electrode structure... Semiconductor device having double side electrode structure...

2008-07-17

2011-11-08

Tran, Long K. (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S110000, C438S127000, C438S113000, C257S778000, C257S787000, C257S791000, C257S676000, C257S713000

Reexamination Certificate

active

08053275

ABSTRACT:
A semiconductor device includes a package substrate having a front surface and a backside surface; an electrode pad formed on the front surface; an outer connection pad formed on the backside surface and electrically connected to the electrode pad; a semiconductor chip mounted on the front surface and having an electrode electrically connected to the electrode pad; a sealing resin layer having a through hole formed with a die-molding and reaching the electrode pad for sealing the semiconductor chip; and a through electrode filled in the through hole with a conductive material and having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer.

REFERENCES:
patent: 7364948 (2008-04-01), Lai et al.
patent: 2002/0117743 (2002-08-01), Nakatani et al.
patent: 2004/0160752 (2004-08-01), Yamashita et al.
patent: 2005/0046001 (2005-03-01), Warner
patent: 2006/0290011 (2006-12-01), Cobbley et al.
patent: 2007/0181989 (2007-08-01), Corisis et al.
patent: 2002-158312 (2002-05-01), None
patent: 2003-249604 (2003-09-01), None
patent: 2005-235824 (2005-09-01), None

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