Patent
1988-04-19
1991-01-08
Sikes, William L.
357 65, H01L 2702
Patent
active
049840517
ABSTRACT:
The present invention relates to an improvement in an electrode structure of a semiconductor device having a MOSFET chip, wherein a source terminal is directly connected to a source electrode of the semiconductor device so that the source terminal overlaps with the source electrode. By employing the electrode structure, a semiconductor device having a high switching speed, low power loss and high mass productivity is obtained.
REFERENCES:
patent: 4574299 (1986-03-01), Glascock
patent: 4866502 (1989-09-01), Tomaszewski et al.
Mitsubishi Denki & Kabushiki Kaisha
Sikes William L.
Wise Robert E.
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