Semiconductor device having contoured package body profile

Details Semiconductor device having contoured package body profile Semiconductor device having contoured package body profile

1995-09-05

1998-01-13

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

257787, H01L 2304

Patent

active

057083002

ABSTRACT:
An overmolded semiconductor device (30, 50) has a contoured package body profile instead of a conventional flat package body surface for uniform filling during the molding process. A cross-section of the semiconductor device reveals a substantially uniform thickness of plastic (36 and 38) covering the carrier substrate (14) and overmolding the semiconductor die (12). Alternatively, a thicker layer of plastic (58) overmolds the semiconductor die (12') than the layer of plastic (56) covering the carrier substrate (14'). The contoured package body profile is designed to allow a uniform flow front progression of molding compound during the molding process to eliminate voids in the package body by providing the same resistive pressure to the molding compound flow front during filling.

REFERENCES:
patent: 3978578 (1976-09-01), Murphy
patent: 5191403 (1993-03-01), Nakazawa
patent: 5289039 (1994-02-01), Ishida et al.
patent: 5319522 (1994-06-01), Mehta
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5554887 (1996-09-01), Sawai et al.

Affiliated with

Also associated with

Rating

Semiconductor device having contoured package body profile does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having contoured package body profile, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having contoured package body profile will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-329134