Semiconductor device having conductor layers stacked on a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S127000, C257S170000, C257S409000, C257S452000, C257S484000, C257S605000, C257S760000

Reexamination Certificate

active

06838771

ABSTRACT:
As etch-stop films or Cu-diffusion barrier films used in insulation films constituting conductor layers of a stacked structure, films having smaller dielectric constant than silicon nitride films are used, and an insulation film at a lower-layer part of the stacked structure is made to have smaller dielectric constant than that at an upper-layer part thereof, and further this insulation film is a silicon oxide (SiO) film and has in the interior thereof, nano-pores of from 0.05 nm or more to 4 nm or less in diameter as chief construction. This makes it possible to dramatically reduce effective dielectric constant while keeping the mechanical strength of the conductore layers themselves, and can materialize a highly reliable and high-performance semiconductor device having mitigated the wiring delay of signals which pass through wirings.

REFERENCES:
patent: 6124216 (2000-09-01), Ko et al.
patent: 6316351 (2001-11-01), Chen et al.
patent: 6383913 (2002-05-01), Tsai et al.
patent: 6407011 (2002-06-01), Ikeda et al.
patent: 6559548 (2003-05-01), Matsunaga et al.
patent: 6670710 (2003-12-01), Matsunaga
patent: 2-217198 (1990-08-01), None
patent: 2000-340569 (2000-12-01), None
patent: 2001-274239 (2001-10-01), None
International Technology Roadmap for Semiconductors, 1999 Edition, pp. 163-166.

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